Evaluation of solder-joint reliability for a 10mm Quad Flat Leadless package with top-side paddle using classical models for a leadless device and accelerated life testing

Abstract

The standard QFN package consists of a leadless perimeter array and a bottom solderable thermal paddle. The thermal performance of the package can be improved by moving the paddle to the topside. The soldered surface area of the package reduces by about 80% with a top-side paddle. The soldered-joint life will also reduce due to the significant thermal coefficient of expansion mismatch between the QFN package and the circuit board. The solder-joint reliability of a large QFN package with top-side paddle is not well understood. This thesis evaluates the solder-joint reliability of a 10mm square leadless QFN package with top-side paddle. The analysis includes several classical models for a leadless package and compares modeling results to accelerated reliability testing. The accelerated tests include the influence mold compound and lead finish play on solder-joint life and ways to improve solder-joint reliability.