Now showing items 1-4 of 4
Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency
In this paper, we develop an accurate dynamic thermal management DTM approach considering the interdependency of temperature and leakage. By modeling the leakage-thermal interdependence as a quadratic polynomial, we develop ...
Unified Datacenter Power Management Considering On-Chip and Air Temperature Constraints
The current approaches for datacenter power management (workload scheduling, CPU speed control, etc) focus primarily on maintaining the air temperature surrounding servers to be within the manufacturer specified constraint. ...
TSV-Constrained Micro-Channel Infrastructure Design for Cooling Stacked 3D-ICs
Micro-channel based liquid cooling has significant capability of removing high density heat in 3D-ICs. The conventional micro-channel structures investigated for cooling 3D-ICs use straight channels. However, the presence ...
Fluidic Cooling and Gate Size Co-optimization in 3D-ICs: Pushing the Power-Performance Limits
The performance improvement of modern computer systems is usually accompanied by increased computational power and thermal hotspots, which in turn limit the further improvement of system performance. In 3D-ICs, this thermal ...