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Vertically integrated modules for low power embedded sensor systems

dc.contributor.advisorGoldsman, Neilen_US
dc.contributor.authorBles, Christopheren_US
dc.date.accessioned2006-09-12T06:08:25Z
dc.date.available2006-09-12T06:08:25Z
dc.date.issued2006-08-30en_US
dc.identifier.urihttp://hdl.handle.net/1903/3945
dc.description.abstractA typical embedded sensor system consists of an environmental sensor, data storage, and a control circuit (such as a microcontroller). Two main traits desired of these embedded sensor systems are small form factor and low power consumption. However, due to the diverse nature of the design and applications, monolithic solutions incorporating the three main components are often not available on a large cost effective scale. This work describes a method of integrating heterogeneous circuit components into a single module. When combined with efficient operating algorithms the system size is reduced and lifetime is extended. Production or custom designed component chips are thinned and stacked vertically while interconnects are fabricated within the module providing a 3-D integration (3DI) of the system. A Global Positioning System (GPS) location recording sensor system is designed with the intention of applying the 3DI process to reduce its size and power consumption.en_US
dc.format.extent3040188 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.titleVertically integrated modules for low power embedded sensor systemsen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentElectrical Engineeringen_US
dc.subject.pqcontrolledEngineering, Electronics and Electricalen_US
dc.subject.pquncontrolledmulti layer circuitsen_US
dc.subject.pquncontrolledembedded systemsen_US
dc.subject.pquncontrolledGPS loggeren_US
dc.subject.pquncontrolleddeep high aspect ratio via etchingen_US
dc.subject.pquncontrolledhigh pressure via metallizationen_US


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