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dc.contributor.advisorDasgupta, Abhijiten_US
dc.contributor.authorLin, Elaineen_US
dc.date.accessioned2016-06-22T06:19:56Z
dc.date.available2016-06-22T06:19:56Z
dc.date.issued2016en_US
dc.identifierhttps://doi.org/10.13016/M2DF64
dc.identifier.urihttp://hdl.handle.net/1903/18420
dc.description.abstractThe effect of isothermal aging on the harmonic vibration durability of Sn3.0Ag0.5Cu solder interconnects is examined. Printed wiring assemblies with daisy-chained leadless chip resistors (LCRs) are aged at 125°C for 0, 100, and 500 hours. These assemblies are instrumented with accelerometers and strain gages to maintain the same harmonic vibration profile in-test, and to characterize PWB behavior. The tested assemblies are excited at their first natural frequencies until LCRs show a resistance increase of 20%. Dynamic finite element models are employed to generate strain transfer functions, which relate board strain levels observed in-test to respective solder strain levels. The transfer functions are based on locally averaged values of strains in critical regions of the solder and in appropriate regions of the PWB. The vibration test data and the solder strains from FEA are used to estimate lower-bound material fatigue curves for SAC305 solder materials, as a function of isothermal pre-aging.en_US
dc.language.isoenen_US
dc.titleEFFECT OF ISOTHERMAL AGING ON SAC305 HARMONIC VIBRATION DURABILITYen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledEngineeringen_US
dc.subject.pquncontrolledagingen_US
dc.subject.pquncontrolleddurabilityen_US
dc.subject.pquncontrolledharmonicen_US
dc.subject.pquncontrolledlead freeen_US
dc.subject.pquncontrolledSAC305en_US
dc.subject.pquncontrolledvibrationen_US


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