Show simple item record

Structural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronics

dc.contributor.advisorMcCluskey, F. Patricken_US
dc.contributor.authorKhanna, Sumeeren_US
dc.date.accessioned2015-06-25T05:39:18Z
dc.date.available2015-06-25T05:39:18Z
dc.date.issued2015en_US
dc.identifierhttps://doi.org/10.13016/M2X04J
dc.identifier.urihttp://hdl.handle.net/1903/16442
dc.description.abstractThermal management has become increasingly important to ensuring the reliability of power electronics components due to the continuing increase of device power and integration levels. New approaches to provide the necessary thermal management include the development of embedded two-phase cooling systems. However, the reliability of such devices and that of their integration into the power electronics package have yet to be studied. This thesis details a Physics of Failure (PoF) based structural reliability analysis of novel 3-D integrated thermal packaging for next generation Power Electronics. The cooling technology aims to combine two-phase embedded manifold microchannel cooling in thin film evaporation mode with thermoelectric hot-spot cooling using a high conductivity Mini-contact. This study will focus on thermo-mechanical stress analysis of three different Mini-contact structures, micro-fin structure and reliability prediction of solder joint at various levels in Power Electronics package based on Engelmaier's failure model for SAC 305.en_US
dc.language.isoenen_US
dc.titleStructural Reliability of Novel 3-D Integrated Thermal Packaging for Power Electronicsen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledMechanical engineeringen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record