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dc.contributor.advisorDasgupta, Abhijiten_US
dc.contributor.authorDouglas, Stuart Tayloren_US
dc.date.accessioned2010-10-07T06:13:13Z
dc.date.available2010-10-07T06:13:13Z
dc.date.issued2010en_US
dc.identifier.urihttp://hdl.handle.net/1903/10957
dc.description.abstractThe focus of this thesis is the investigation of extremely high accelerations through secondary impact and its effect on reliability of printed wiring assemblies. The test equipment consists of a commercially available drop system and a commercially available attachment termed a Dual Mass Shock Amplifier (DMSA), which extends the impact acceleration range to as much as 30,000 Gs by utilizing secondary impact dynamics. Further secondary impacts between the test vehicle and fixture are intentionally generated in simulation and tested experimentally to imitate board 'slap' phenomena in product assemblies, and to generate even further amplification of the acceleration at various locations on the test specimen. In this thesis a detailed description of the test equipment and modeling techniques are provided. Model complexity ranges from simple analytic closed-form rigid-body mechanics to detailed nonlinear dynamic finite element analysis. The effects of different equipment design parameters (table mass, spring stiffness, table clearance) are investigated through parametric modeling. The effects of contact parameters (constraint enforcement algorithms, stiffness, damping) on model accuracy are explored. Test fixtures for high shock accelerations are discussed and used for board level reliability testing of printed wire assemblies containing WLCSP49s and MEMS microphones.en_US
dc.titleHIGH ACCELERATIONS PRODUCED THROUGH SECONDARY IMPACT AND ITS EFFECT ON RELIABILITY OF PRINTED WIRING ASSEMBLIESen_US
dc.typeThesisen_US
dc.contributor.publisherDigital Repository at the University of Marylanden_US
dc.contributor.publisherUniversity of Maryland (College Park, Md.)en_US
dc.contributor.departmentMechanical Engineeringen_US
dc.subject.pqcontrolledEngineering, Electronics and Electricalen_US
dc.subject.pqcontrolledEngineering, Mechanicalen_US
dc.subject.pquncontrolleddrop testen_US
dc.subject.pquncontrolleddrop toweren_US
dc.subject.pquncontrolledPWBen_US
dc.subject.pquncontrolledsecondary impacten_US


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