Browsing by Author "Dasgupta, Abhijit"

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    Direct visualization of nanoparticle morphology in thermally sintered nanoparticle ink traces and the relationship among nanoparticle morphology, incomplete polymer removal, and trace conductivity
    (Institute of Physics, 2023-06-19) Chandel, Ghansham Rajendrasingh; Sun, Jiayue; Etha, Sai Ankit; Zhao, Beihan; Sivasankar, Vishal Sankar; Nikfarjam, Shakiba; Wang, Mei; Hines, Daniel R.; Dasgupta, Abhijit; Woehl, Taylor; Das, Siddartha
    A key challenge encountered by printed electronics is that the conductivity of sintered metal nanoparticle (NP) traces is always several times smaller than the bulk metal conductivity. Identifying the relative roles of the voids and the residual polymers on NP surfaces in sintered NP traces, in determining such reduced conductivity, is essential. In this paper, we employ a combination of electron microscopy imaging and detailed simulations to quantify the relative roles of such voids and residual polymers in the conductivity of sintered traces of a commercial (Novacentrix) silver nanoparticle-based ink. High resolution transmission electron microscopy imaging revealed details of the morphology of the inks before and after being sintered at 150 °C. Prior to sintering, NPs were randomly close packed into aggregates with nanometer thick polymer layers in the interstices. The 2D porosity in the aggregates prior to sintering was near 20%. After heating at 150 °C, NPs sintered together into dense aggregates (nanoaggregates or NAgs) with sizes ranging from 100 to 500 nm and the 2D porosity decreased to near 10%. Within the NAgs, the NPs were mostly connected via sintered metal bridges, while the outer surfaces of the NAgs were coated with a nanometer thick layer of polymer. Motivated by these experimental results, we developed a computational model for calculating the effective conductivity of the ink deposit represented by a prototypical NAg consisting of NPs connected by metallic bonds and having a polymer layer on its outer surface placed in a surrounding medium. The calculations reveal that a NAg that is 35%–40% covered by a nanometer thick polymeric layer has a similar conductivity compared to prior experimental measurements. The findings also demonstrate that the conductivity is less influenced by the polymer layer thickness or the absolute value of the NAg dimensions. Most importantly, we are able to infer that the reduced value of the conductivity of the sintered traces is less dependent on the void fraction and is primarily attributed to the incomplete removal of the polymeric material even after sintering.
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    Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints
    (MDPI, 2021-10-11) Jiang, Qian; Deshpande, Abhishek Nitin; Dasgupta, Abhijit
    Heterogeneous integration is leading to unprecedented miniaturization of solder joints, often with thousands of joints within a single package. The thermomechanical behavior of such SAC solder joints is critically important to assembly performance and reliability, but can be difficult to predict due to the significant joint-to-joint variability caused by the stochastic variability of the arrangement of a few highly-anisotropic grains in each joint. This study relies on grain-scale testing to characterize the mechanical behavior of such oligocrystalline solder joints, while a grain-scale modeling approach has been developed to assess the effect of microstructure that lacks statistical homogeneity. The contribution of the grain boundaries is modeled with isotropic cohesive elements and identified by an inverse iterative method that extracts material properties by comparing simulation with experimental measurements. The properties are extracted from the results of one test and validated by verifying reasonable agreement with test results from a different specimen. Equivalent creep strain heterogeneity within the same specimen and between different specimens are compared to assess typical variability due to the variability of microstructure.
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    Predictive Mechanistic Model of Creep Response of Single-Layered Pressure-Sensitive Adhesive (PSA) Joints
    (MDPI, 2021-07-08) Huang, Hao; Dasgupta, Abhijit; Singh, Narendra
    This paper explores the uniaxial tensile creep response of acrylic-based pressure-sensitive adhesive (PSA), which exhibits a unique multi-phase creep response that does not have the classical steady-state region due to multiple transitions caused by several competing mechanisms: (i) cavity nucleation and growth in the interior of the adhesive material of the PSA system, as well as at the interfaces between the PSA and the substrate; (ii) fibrillation of the bulk adhesive, and (iii) interfacial mechanical locking between the adhesive and the bonding substrate. This results in multiple regimes of strain hardening and strain softening, evidenced by multiple regions of steady-state creep, separated by strong transitions in the creep rates. This complex, multi-phase, nonlinear creep response cannot be described by conventional creep constitutive models commonly used for polymers in commercial finite element codes. Accordingly, based on the empirical uniaxial tensile creep response and the mechanisms behind it, a new mechanistic model was proposed. This is capable of quantitatively capturing the characteristic features of the multiphase creep response of single-layered PSA joints as a function of viscoelastic bulk properties and free energy of the PSA material, substrate surface roughness, and interfacial surface energy between the adhesive and substrate. This is the first paper to present the modeling approach for capturing unique multi-phase creep behavior of PSA joint under tensile loading.