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An Analytical Model for Developing a Canary Device to Predict Solder Joint Fatigue Failure under Thermal Cycling Conditions
Solder joint fatigue failure is a prevalent failure mechanism for electronics subjected to thermal cycling loads. The failure is attributed to the thermo-mechanical stresses in the solder joints caused by differences in ...
Health Status Assessment Methodology for Electronic Hardware
Remaining life assessment is the process of predicting the future operational life of a product based on estimate of life consumed under its life cycle environmental conditions. Remaining life is typically an output of ...