Now showing items 1-2 of 2
A NON-LINEAR DAMAGE MODEL WITH LOAD DEPENDENT EXPONENTS FOR SOLDERS UNDER SEQUENTIAL CYCLIC SHEAR LOADS
The damage state of a material subject to cyclic loads is often characterized by the cycle ratio of applied cycles to the number of survivable cycles. The damage in a material under sequential cyclic loading is widely ...
THERMAL CYCLING RELIABILITY OF LEAD-FREE SOLDERS (SAC305 AND SN3.5AG) FOR HIGH TEMPERATURE APPLICATIONS
Eutectic tin lead was the most widely used solder interconnect in the electronics industry before the adoption of lead-free legislation. But eutectic tin lead solder has a low melting point (183<super>o</super>C) and was ...