Digital Repository at the University of Maryland (DRUM)  >
Theses and Dissertations from UMD  >
UMD Theses and Dissertations 

Please use this identifier to cite or link to this item:

Authors: Kwong, Brian
Advisors: Han, Professor Bongtae
Department/Program: Mechanical Engineering
Type: Thesis
Sponsors: Digital Repository at the University of Maryland
University of Maryland (College Park, Md.)
Subjects: Mechanical engineering
Issue Date: 2012
Abstract: With the increasingly smaller electronic package size, warpage of electronic packages becomes an important measurement related to the reliability of the products. Higher sensitivity out-of-plane deformation techniques are required to capture the smaller deformations of tiny packages for enhanced design analysis and model verification. The higher sensitivity is realized using non-zero viewing angles with the conventional shadow moirĂ© technique. Advanced configurations to accommodate the non-zero viewing angles are developed to cope with direct reflection encountered on the conventional setup. An expanded governing equation for the configuration is derived and verified experimentally. Then the proposed configuration was implemented in the testing of an actual package to demonstrate the advantages that accrue from the higher sensitivity.
Appears in Collections:Mechanical Engineering Theses and Dissertations
UMD Theses and Dissertations

Files in This Item:

File Description SizeFormatNo. of Downloads
Kwong_umd_0117N_13513.pdf2.5 MBAdobe PDF304View/Open

All items in DRUM are protected by copyright, with all rights reserved.


DRUM is brought to you by the University of Maryland Libraries
University of Maryland, College Park, MD 20742-7011 (301)314-1328.
Please send us your comments